Thermally driven microvalve with buckling behavior for pneumatic applications

Sensors and Materials

Volumn 8, Issue 5, 1996, Pages 303-316

  Lisec, T ^a   Quenzer, H J ^a   Kreutzer, M ^a   Hoerschelmann, S ^a   Wagner, B ^a   Benecke, W ^b  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

^b UNIVERSITY OF BREMEN   (Germany)

Author keywords

Silicon microvalve; Thermally induced buckling; Thermomechanical actuation

Indexed keywords

EID: 0030544613     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

1. M. A. Huff, J. R. Gilbert and M. A. Schmidt: Proc. Transducers '93, Yokohama, p. 98.
2. T. Ohnstein, T. Fukiura, J. Ridley and U. Bonne: Proc. MEMS '90, Napa Valley, p. 95.
3. H.-P. Trah, H. Baumann, C. Döring, H. Goebel, T. Grauer and M. Mettner: Sensors and Actuators A 39 (1993) 169.
4. S. Shoji, B. van der School, N. de Rooji and M. Esashi: Proc. Transducers '91, San Fransisco, p. 1052.
5. K. Yanagisawa, H. Kuwano and A. Tago: Proc. Transducers '93, Yokohama, p. 102.
6. B. Wagner and W. Benecke: Proc. MEMS '91, Nara, p. 27.
7. M. Shikida, K. Sato, S. Tanaka, Y. Kawamura and Y. Fujisaki: Proc. Transducers '93, Yokohama, p. 94.
8. J. Branebjerg and P. Gravesen: Proc. MEMS '92, Travemünde, p. 6.
9. H. Jerman: Proc. Transducers '91, San Francisco, p. 1045.
10. B. Hälg: IEEE Transact, on Electron Devices 37 (1990) 2230.
11. U. Lindberg, J. Söderkvist, T. Lammerink and M. Elwenspoek: Proc. Micro Mechanics Europe '93, Neuchatel, p. 115.