Thermal properties and electric field profile in metallized dielectric film adhesively bonded to substrate

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report

Volumn 2, Issue , 1996, Pages 721-725

  Bloss, Peter ^a   De Reggi, Aime S ^a   Schafer, Hartmut ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC PROPERTIES OF SOLIDS; ELECTRIC FIELD EFFECTS; ELECTRIC FIELDS; ELECTRODES; HEAT CONDUCTION; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; METALLIZING; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; TEMPERATURE DISTRIBUTION; THERMAL DIFFUSION IN SOLIDS;

DECONVOLUTION; DIELECTRIC CHARGING; METALLIZED DIELECTRIC FILMS; THERMAL PULSE METHOD; TIKHONOV REGULARIZATION TECHNIQUE;

DIELECTRIC FILMS;

EID: 0030422329     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)