Electrical breakdown properties of low density polyethylene film due to morphological change

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report

Volumn 2, Issue , 1996, Pages 692-696

  Hong, Nung Pyo ^a   Im, Pil Gyu ^a   Kim, Deok Jung ^a   Cho, Kyung Soon ^a   Cho, Don Chan ^a   Lee, Yong Woo ^a   Hong, Jin Woong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; CRYSTAL STRUCTURE; DIELECTRIC FILMS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC BREAKDOWN OF SOLIDS; IMPULSE TESTING; LIGHT ABSORPTION; LOW DENSITY POLYETHYLENES; MORPHOLOGY; PLASTIC FILMS; THERMAL EFFLUENTS; X RAY DIFFRACTION ANALYSIS;

DIRECT CURRENT BREAKDOWN; IMPULSE BREAKDOWN;

ELECTRIC INSULATING MATERIALS;

EID: 0030421725     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)