High temperature deformation of high density interconnects and packages by Moire interferometry/FEM hybrid method

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 75-83

  Zhu, Jiansen ^a   Zou, Daqing ^a   Dai, Fulong ^a   Liu, Sheng ^a   Guo, Yi Fan ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DEFORMATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HIGH TEMPERATURE EFFECTS; INTERFEROMETRY; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERED JOINTS; SOLDERING; STRAIN;

HIGH DENSITY AREA INTERCONNECTS; MOIRE INTERFEROMETRY; WARPAGE;

ELECTRONICS PACKAGING;

EID: 0030418512     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)