Improvement of immunity to electromigration by means of microstructural design

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 231-236

  Kononenko, O V ^a   Matveev, V N ^a  

^a RUSSIAN ACADEMY OF SCIENCES   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY OF SOLIDS; FILM PREPARATION; GRAIN BOUNDARIES; GRAIN GROWTH; METALLIZING; SPUTTER DEPOSITION; THIN FILMS;

INTERCONNECT METALLIZATION;

ELECTROMIGRATION;

EID: 0030417851     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-428-231     Document Type: Conference Paper

References (9)