High-temperature deformation and fracture processes in sintered reaction-bonded silicon nitride

Journal of Materials Science

Volumn 31, Issue 24, 1996, Pages 6477-6483

  Lin, Hua Tay ^a   Kiggans Jr , J O ^a   Tiegs, T N ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; CRACK INITIATION; CRACK PROPAGATION; CREEP; FRACTURE MECHANICS; FRACTURE TOUGHNESS; HIGH TEMPERATURE EFFECTS; HIGH TEMPERATURE TESTING; IMPURITIES; MICROWAVE HEATING; POWDERS; THERMAL STRESS;

CREEP ASSISTED CRACK GROWTH (CACG); SINTERED REACTION BONDED SILICON NITRIDE (SRBSN);

SILICON NITRIDE;

EID: 0030416210     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00356251     Document Type: Article

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