Thermal interaction between laminar film condensation and forced convection along a conducting wall

Acta Mechanica

Volumn 118, Issue , 1996, Pages 13-26

  Chen, H T ^a   Chang, S M ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; BOUNDARY LAYER FLOW; BOUNDARY VALUE PROBLEMS; CONDENSATION; HEAT CONVECTION; HEAT FLUX; HEAT RESISTANCE; LAMINAR FLOW; MATHEMATICAL TRANSFORMATIONS; NUMERICAL METHODS; PRANDTL NUMBER; THERMAL CONDUCTIVITY;

JAKOB NUMBER; NACHTSHEIM SWIGERT ITERATION; NONSIMILARITY METHODS; NONSIMILARITY TRANSFORMATION; RUNGE KUTTA METHODS; THERMAL INTERACTIONS; THERMAL RESISTANCE RATIO;

WALL FLOW;

EID: 0030415026     PISSN: 00015970     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF01410504     Document Type: Article

References (13)

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