Applications of silicon nitride ceramics

Key Engineering Materials

Volumn , Issue 122-124, 1996, Pages 479-488

  Riley, F L ^a  

^a UNIVERSITY OF LEEDS   (United Kingdom)

Author keywords

Applications; High Temperature Strength; Hot Pressed; Reaction Bonded; Sialon; Silicon Nitride; Sintered; Thermal Expansion Coefficient; Thermal Shock Resistance; Thin Film; Wear

Indexed keywords

AMORPHOUS FILMS; CERAMIC MATERIALS; HIGH TEMPERATURE PROPERTIES; HOT PRESSING; POLYCRYSTALLINE MATERIALS; SILICON; SINTERING; STRENGTH OF MATERIALS; THERMAL EXPANSION; THIN FILMS; WEAR OF MATERIALS;

REACTION BONDED; THERMAL EXPANSION COEFFICIENT; THERMAL SHOCK RESISTANCE;

SILICON NITRIDE;

EID: 0030414996     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

References (10)

1. Gmelin Handbook of Inorganic and Organometallic Chemistry, Silicon Supplement Volume B5c, "Silicon Nitride in Microelectronics and Solar Cells", (Springer Verlag, Berlin, 1995).
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9. R. Carlsson, T. Johansson, L. Kahlman (Eds.), 4th International Symposium on Ceramic Materials for Engines, London, Elsevier Applied Science (1992).
10. I-W. Chen, P.F. Becher, M. Mitomo, G. Petzow, T.-S. Yen (Eds.),Silicon Nitride Ceramics, Materials Research Society Symposium Proceedings, Volume 287, Pittsburgh, Materials Research Society (1992).