Chip scale packaging with high reliability for MCM applications

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 4, 1996, Pages 427-432

  Loboda, M J ^a,d,e   Camilletti, R C ^a   Goodman, L A ^b   White, L K ^b   Pinch, H L ^b   Shaw, J ^b   Patel, V K ^b   Wu, C P ^b   Adema, G M ^c  

^a DOW CORNING CORPORATION   (United States)

^b SARNOFF CORPORATION   (United States)

^c MCNC   (United States)

^d DEPAUL UNIVERSITY   (United States)

^e RAYTHEON COMPANY   (United States)

Author keywords

Electronic Packaging; Multichip Modules (MCM); Reliability; Thin Film Materials

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATING CIRCUITS; MANUFACTURE; RELIABILITY; SEMICONDUCTOR MATERIALS; SILICON; THIN FILMS;

CHIP SCALE PACKAGING; THIN FILMS MATERIALS;

MULTICHIP MODULES;

EID: 0030413888     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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