Low Operation Voltage Field Emitter Arrays Using Low Work Function Materials Fabricated by Transfer Mold Technique.

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1996, Pages 297-300

  Nakamoto, Masaywki ^a   Hasegawa, Toshimichi ^a   Ono, Tomio ^a   Sakai, Tadashi ^a   Sakuma, Naoshi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON AFFINITY; FABRICATION; LANTHANUM COMPOUNDS; MOLDS; SILICA; TIN; TITANIUM NITRIDE; ETCHING; INTEGRATED CIRCUIT MANUFACTURE; SEMICONDUCTING SILICON COMPOUNDS; THERMOOXIDATION; TRANSFER MOLDING; VAPOR DEPOSITION;

EMITTER ARRAYS; EMITTER FABRICATION; FABRICATION TECHNIQUE; FIELD EMITTER; FUNCTION MATERIAL; HIGH EFFICIENT; HIGH RELIABLE; OPERATION VOLTAGE; SHARPENING EFFECT; TRANSFER MOLD TECHNIQUE;

WORK FUNCTION; MICROELECTRONIC PROCESSING;

ELECTROSTATIC BONDING; FIELD EMITTER ARRAYS; LOW WORK FUNCTION MATERIALS;

EID: 0030413569     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1996.553588     Document Type: Conference Paper

References (7)

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