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Volumn 427, Issue , 1996, Pages 83-94
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In-situ UHV electromigration in Cu films
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
COPPER;
DIFFUSION IN SOLIDS;
ELECTRIC RESISTANCE MEASUREMENT;
INTERFACES (MATERIALS);
SEMICONDUCTING FILMS;
SURFACE PHENOMENA;
ULSI CIRCUITS;
COPPER STRIPES;
CURRENT STRESSING;
ELECTROMIGRATION DAMAGE;
ELECTROMIGRATION;
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EID: 0030412666
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-427-83 Document Type: Conference Paper |
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Times cited : (1)
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References (18)
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