Separation of a molten axisymmetric solder joint

American Society of Mechanical Engineers, EEP

Volumn 16, Issue , 1996, Pages 169-173

  Goldmann, Lewis S ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEURISTIC METHODS; LIQUID METALS; STRETCHING; TENSILE TESTING;

ELECTRONIC COMPONENT REWORK; MOLTEN AXISYMMETRIC SOLDER JOINTS; TWO SIDED JOINING;

SOLDERED JOINTS;

EID: 0030409875     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (8)