Initial non-isothermal experimental study of the constrained vapor bubble thermosyphon

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 327, Issue , 1996, Pages 121-129

  Karthikeyan, M ^a   Huang, J ^a   Plawsky, J ^a   Wayner Jr , P C ^a  

^a Rensselaer Polytechnic Institute   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUBBLES (IN FLUIDS); CONDENSATION; HEAT RESISTANCE; HEAT TRANSFER; INTERFEROMETERS; PRESSURE; TEMPERATURE;

CONSTRAINED VAPOR BUBBLE THERMOSYPHON; NON ISOTHERMAL TRANSPORT; THERMAL CONDUCTANCE;

LIQUIDS;

EID: 0030409759     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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3. DasGupta, S., Plawsky, J. L., and Wayner, P. C., Jr., 1995, "Interfacial Force Field Characterization in a Constrained Vapor Bubble Thermosyphon", AIChE Journal, 41(9), pp. 2140-2149.
4. Dunn, P. D., and Reay, D. A., 1994, "Heat Pipes", Fourth Edition, Pergamon, Oxford.
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7. Peterson, G. P., Duncan, A. B., Ahmed, A. S., Mallik, A. K., and Weichold, M. H., 1991, "Experimental Investigation of Micro Heat Pipes in Silicon Wafers", ASME Winter Ann. Meet., Atlanta, GA, Dec. 1-6, 1991.
8. Peterson, G. P., 1992, "Overview of Micro Heat Pipe Research and Development", Appl Mech Rev, 45(5), pp. 175-189.