Duty cycle and frequency effects of pulsed-DC currents on electromigration-induced stress in Al interconnects

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 109-114

  Frankovic, Richard ^a   Bernstein, Gary H ^a   Clement, J Joseph ^a  

^a UNIVERSITY OF NOTRE DAME   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; THERMAL STRESS;

DUTY CYCLE; EDGE DISPLACEMENT TECHNIQUE; FREQUENCY EFFECTS; MEDIAN TIME TO FAILURE (MTF); PULSED CURRENT STRESS;

ELECTROMIGRATION;

EID: 0030409048     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-428-109     Document Type: Conference Paper

References (11)