Measurement of low-K polymer/metal interfacial toughness using 4-point bending method

Materials Research Society Symposium - Proceedings

Volumn 436, Issue , 1996, Pages

  Ma, Qing ^a   Pan, Chuanbin ^a   Fujimoto, Harry ^a   Triplett, Baylor ^a   Coon, Peter ^a   Chiang, Chien ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; BENDING (DEFORMATION); BONDING; HEAT TREATMENT; MECHANICAL VARIABLES MEASUREMENT; ORGANIC POLYMERS; THERMAL EFFECTS; TOUGHNESS;

ALUMINUM FILMS; BENDING MOMENT; FOUR POINT BENDING METHOD; POLYARYLENE ETHER;

INTERFACES (MATERIALS);

EID: 0030406249     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (4)