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Volumn 429, Issue , 1996, Pages 43-49
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Effect of multilayer patterns on thermal stress during rapid thermal processing
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
ELECTROMAGNETISM;
FINITE ELEMENT METHOD;
MATHEMATICAL MODELS;
PLASTIC DEFORMATION;
PROCESSING;
SILICON WAFERS;
TEMPERATURE DISTRIBUTION;
THERMAL GRADIENTS;
THERMAL STRESS;
AXISYMMETRIC REACTORS;
MULTILAYERS PATTERNS;
PROCESS PARAMETERS;
RAPID THERMAL PROCESSING;
MULTILAYERS;
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EID: 0030405378
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (22)
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