Peel strength in the Cu/Cr/polyimide system

Materials Research Society Symposium - Proceedings

Volumn 436, Issue , 1996, Pages

  Park, I S ^a   Yu, Jin ^a   Park, Y B ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM; COPPER; INTERFACIAL ENERGY; MATERIALS TESTING; PEELING; PLASMA APPLICATIONS; PLASTIC DEFORMATION; POLYIMIDES; THICKNESS MEASUREMENT; X RAYS;

ELASTOPLASTIC BEAM ANALYSIS; PEEL STRENGTH; PLASTICITY EFFECT; STRESS STRAIN CURVES; X RAY MEASUREMENTS;

MULTILAYERS;

EID: 0030405099     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-436-133     Document Type: Conference Review

References (17)