Cost effective, weight sensitive design for military airborne electronic systems

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 329, Issue , 1996, Pages 245-253

  Peck, Wiley M ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COST EFFECTIVENESS; ELECTRONICS PACKAGING; ENERGY MANAGEMENT; FUEL ECONOMY; HEAT RESISTANCE; INTEGRATED CIRCUITS; THERMAL EXPANSION; THERMODYNAMICS;

MILITARY AIRBORNE ELECTRONIC SYSTEMS; THERMAL EXPANSION COEFFICIENT; THERMAL MANAGEMENT; WEIGHT SENSITIVE DESIGN;

ELECTRONIC EQUIPMENT;

EID: 0030402846     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

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