Single-phase flow thermal performance characteristics of a parallel micro-channel heat exchanger

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 329, Issue , 1996, Pages 157-161

  Ravigururajan, T S ^a   Cuta, J ^b   McDonald, C E ^b   Drost, M K ^b  

^a Wichita State University   (United States)

^b PACIFIC NORTHWEST NATIONAL LABORATORY   (United States)

Author keywords

Heat transfer enhancement; High flux heat transfer; Micro channel heat exchangers

Indexed keywords

COMPRESSIBLE FLOW; FLUIDS; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; HEATING; MATHEMATICAL MODELS; PERFORMANCE; TESTING; THERMAL CONDUCTIVITY;

MICROCHANNEL HEAT EXCHANGERS; SINGLE PHASE FLOW;

HEAT EXCHANGERS;

EID: 0030402692     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

1. Bier, W., Keller, W., Linder, G., Siegel, D., and Schubert, K., 1990, "Manufacturing and Testing of Compact Micro Heat Exchanger with High Volumetric Heat Transfer Coefficients", ASME Press, DSC-vol. 19, pp.189-197.
2. Bowers, M. B. and Mudawar, I., 1994,"High heat flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks," Int. J. Heat Mass Transfer,vol. 37, No. 2, pp. 321-332.
3. Cuta, J, Benett, W. D., McDonald, C. E., and Ravigururajan, T. S., 1995,"Fabrication and Performance Testing of Micro-Heat Exchangers," SPIE International Conference, 1995, Austin, TX.
4. Goldberg, N., 1984,"Narrow channel forced air heat sink," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, CHMT-7, pp. 154-159.
5. Hwang, L.T., Turlik, I., Reisman, A., (1987), "A Thermal Module for Advanced Packaging," J. Electronic Materials, 16, 347-355.
6. Keyes, R. W., 1984,"Heat transfer in forced convection through fins," EEEE Transactions on Electronic Devices, ED-31, pp. 1218-1221.
7. Kline, S. J. and McClintock, F. A., 1953,"Describing Uncertainties in Singgle-Sample Experiments," Mechanical Engineering, Vol. 75, Jan., pp. 3-8.
8. Mahalingam, M and Andrews, J (1987), "High Performance Air Cooling for Microelectronics," Proc. Intl. Cooling Tech. for Electronic Equipment, Honolulu, HI, 6028-625.
9. Martin, P.M., Bennett, W. D., and Johnston, J. W., 1995,"Micro-channel heat exchangers for advanced climate control," SPIE: Micromachining and Microfabrication '95 Conference, Microlithography and Metrology in Micromachining Session, Austin TX, October 23-24.
10. Nayak, D, Hwang, L.T., Turlik, I., and Reisman, A., 1987, "A High Performance Thermal Module for Computer Packaging," J. Electronic Materials, 16, 357-364.
11. Phillips, R. J., 1987,"Micro-channel Heat Sinks", Advances in Thermal Modeling of Electronic Components and Systems, Vol 2, ASME Press, New York.
12. Tuckerman, D. B. and Pease, R. F., 1981,"High-Performance Heat Sinks for VLSI," IEEE Electron Device Lett., EDL-2, 126-129.
13. Wegeng, R. S. and Drost, M. K., 1994,"Developing new miniature energy systems", Mechanical Engineering, Sept., 82-85.