Microwave circuit modeling of an elevated paddle surface mount package

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1996, Pages 199-201

  Jackson, Robert W ^a   Rakshit, Sambarta ^a  

^a UNIVERSITY OF MASSACHUSETTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT THEORY; COMPUTER SIMULATION; ELECTRIC NETWORK TOPOLOGY; MATHEMATICAL MODELS; MICROWAVE CIRCUITS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PLASTICS APPLICATIONS; SURFACE MOUNT TECHNOLOGY;

CIRCUIT MODEL; PLASTIC SURFACE MOUNT PACKAGES;

ELECTRONICS PACKAGING;

EID: 0030401532     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)