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Volumn , Issue , 1996, Pages 468-475
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Next generation coating technologies for low-cost electronics manufacturing
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Author keywords
[No Author keywords available]
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Indexed keywords
COATING TECHNIQUES;
COST EFFECTIVENESS;
DIELECTRIC MATERIALS;
ELECTRONICS PACKAGING;
PHOTORESISTS;
POLYMERS;
SEMICONDUCTING FILMS;
SEMICONDUCTING SILICON;
SUBSTRATES;
EXTRUDE AND SPIN COATING;
EXTRUSION COATING;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0030401271
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (7)
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