Comparison of mesh and solid planes for use in electrical packaging

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1996, Pages 217-219

  Rubin, Barry J ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CALCULATIONS; CROSSTALK; ELECTRIC IMPEDANCE; ELECTROMAGNETIC SHIELDING; ESTIMATION; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS; SPURIOUS SIGNAL NOISE;

MESH PLANE; SOLID PLANE;

ELECTRONICS PACKAGING;

EID: 0030401242     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)