Effect of the finite source material on electromigration performance of a novel interconnect test structure

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 87-92

  Bui, Nguyen D ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

RELIABILITY; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE STRUCTURES;

FINITE SOURCE MATERIALS; NOVEL INTERCONNECT TEST STRUCTURE;

ELECTROMIGRATION;

EID: 0030400293     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-428-87     Document Type: Conference Paper

References (7)