Ion Metal Plasma (IMP) Deposited Titanium Liners for 0.25/0.18 μm Multilevel Interconnections

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1996, Pages 357-360

  Dixit, G A ^a   Hsu, W Y ^a   Konecni, A J ^a   Krishnan, S ^a   Luttmer, J D ^a   Havemann, R H ^a   Forster, J ^b   Yao, G D ^b   Narasimhan, M ^b   Xu, Z ^b   Ramaswami, S ^b   Chen, F S ^b   Nulman, J ^b  

^a TEXAS INSTRUMENTS   (United States)

^b APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INDUCTIVELY COUPLED PLASMA; CAPACITORS; ELECTRIC WIRING; LEAKAGE CURRENTS; LININGS; MOS DEVICES; PLASMAS; VAPOR DEPOSITION;

CAPACITOR STRUCTURES; DEPOSITION PROCESS; INDUCTIVELY COUPLED PLASMA SOURCE; ION METALS; LINER THICKNESS; METAL PLASMA; MULTILEVEL INTERCONNECTION; PLASMA DAMAGE; SUBSTANTIAL REDUCTION; TITANIA;

LEAKAGE CURRENTS; TITANIUM;

ION METAL PLASMA; MULTILEVEL INTERCONNECTIONS; PHYSICAL VAPOR DEPOSITION; TITANIUM LINERS; VIA STRUCTURES;

EID: 0030399669     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1996.553602     Document Type: Conference Paper

References (2)

1. C. Arena, J. Faguet, R. F. Foster, J. T. Hillman, F. Martin and Y. Morand, " CVD Ti and CVD TiN: Electrical performance as contact metallurgy." Advanced Metallization for ULSI Applications in 1994. Materials Research Society ConferenceProceeedings, 1994,pp 259.
2. M. S. Ameen, J. T. Hillman, J Fauget, R. F. Foster, C. Arena and F. Martin, " Characterization of titanium thin films deposited by plasma enhances chemical vapor deposition." Advanced Metallization for ULSI Applications in 1994. Materials Research Society conference Proceedings, 1994, pp 269.