Adhesive bonding via exposure to microwave radiation and resulting mechanical evaluation

Materials Research Society Symposium - Proceedings

Volumn 430, Issue , 1996, Pages 193-206

  Paulauskas, Felix L ^a   Meek, Thomas T ^a   Warren, C David ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; COMPOSITE MATERIALS; CURING; POLYMERIZATION; SHEAR STRESS; TENSILE STRENGTH; TENSILE TESTING;

ADHESIVE BONDING; MICROWAVE PROCESSING; MICROWAVE RADIATION; SINGLE LAP SHEAR TESTS;

MICROWAVE HEATING;

EID: 0030399555     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-430-193     Document Type: Conference Paper

References (2)