Reverse cyclic fatigue of a hot isostatically pressed silicon nitride at 1370 °C

Journal of Materials Science

Volumn 31, Issue 24, 1996, Pages 6541-6553

  Wereszczak, A A ^a   Kirkland, T P ^a   Ferber, M K ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRENGTH; CRACK PROPAGATION; CREEP; FATIGUE OF MATERIALS; FRACTURE; GRAIN BOUNDARIES; HOT ISOSTATIC PRESSING; PRESSURE EFFECTS; STRAIN; TENSILE STRENGTH;

MULTIGRAIN JUNCTION CAVITIES; REVERSE CYCLIC FATIGUE; STATIC CREEP RESISTANCE;

SILICON NITRIDE;

EID: 0030397853     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00356261     Document Type: Article

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