Experimental comparison of different heat sink designs for cooling of electronics

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 329, Issue , 1996, Pages 27-34

  Jonsson, Hans ^a   Palm, Björn ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COOLING; DESIGN; ELECTRONIC EQUIPMENT; FINS (HEAT EXCHANGE); HEAT RESISTANCE; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; PERFORMANCE; PRESSURE DROP; TESTING; VELOCITY;

THERMAL PERFORMANCE;

HEAT SINKS;

EID: 0030397156     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Review

References (6)

1. B. Palm, N. Tengblad, Cooling of Electronics by Heat Pipes and Thermosyphons-a Review of Methods and Possibilities, Paper to the 1996 National Heat Transfer Conference, Heat Pipe Session, Houston, USA, August 3-6, 1996.
2. M. A. Butterbaugh, S. S. Kang, Effect of Airflow Bypass on the Performance of Heat Sinks in Electronic Cooling, Advances in Electronic Packaging 1995, EEP-Vol. 10-2, ASME 1995, ISBN No 0-7918-1303-7.
3. R. A. Wirtz, W. Chen, R. Zhou, Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks, ASME Journal of Electronic Packaging, Vol. 116, pp 206-211, 1994.
4. S. Lee, Optimum Design and Selection of Heat Sinks, IEEE Transactions on Components Packaging and Manufacturing Technology, Part A, Vol. 18, No 4, pp 812-817, 1995.
5. B. Boesmans, F. Christiaens, J. Berghmans, E. Beyne, Design of an optimal heat-sink for forced convection air cooling of Multi-Chip Modules, Proc. EUROTHERM Seminar no. 29 "Thermal Management of Electronic Systems", Delft, The Netherlands, June 14-16, 1993.
6. D. Agonafer, A. Free, Conjugate Model of a Pin-Fin Heat-Sink Using a Hybrid Conductance and CFD Model within an Integrated MCAE Tool, Proc. EUROTHERM Seminar no. 45 "Thermal Management of Electronic Systems", Leuven, Belgium, September 20-22, 1995.