Application of the pin-fin heat sink to electronic equipment [study on design method for flow-guide vanes]

American Society of Mechanical Engineers, EEP

Volumn 18, Issue , 1996, Pages 117-122

  Minakami, Ko ^a   Hisano, Katsumi ^a   Iwasaki, Hideo ^a   Mochizuki, Sadanari ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING SYSTEMS; ELECTRONIC EQUIPMENT; HEAT CONVECTION; HEAT RESISTANCE; HEAT TRANSFER; INTAKE SYSTEMS; LAMINAR FLOW; NUMERICAL ANALYSIS;

FINITE DIFFERENTIAL METHOD; FLOW GUIDE VANES; PIN FINS ARRAY; PRESSURE LOSS;

HEAT SINKS;

EID: 0030396958     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)