Comparison of the Ti/TiN/AlCu/TiN stack with TiN/AlCu/Ti/TiN stack for application in ULSI metallization

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2875, Issue , 1996, Pages 322-333

  Menon, Satish S ^a   Choudhury, Ratan K ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERCONNECTION TECHNOLOGY; SUBMICRON DIMENSIONS;

ALUMINUM; COPPER; CRYSTAL ORIENTATION; ELECTRIC PROPERTIES; METALLIZING; RELIABILITY; THERMAL EFFECTS; TITANIUM; TITANIUM NITRIDE; X RAY DIFFRACTION;

ULSI CIRCUITS;

EID: 0030396281     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)