Emergence of stacked 3D silicon and its impact on microelectronics systems integration

Proceedings of the Annual IEEE International Conference on Innovative Systems in Silicon

Volumn , Issue , 1996, Pages 1-8

  Carson, John ^a  

^a Irvine Sensors Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE;

STACKED THREE DIMENSIONAL SILICON TECHNOLOGY;

MICROELECTRONIC PROCESSING;

EID: 0030395975     PISSN: 10632204     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)