Thermal evaluation of a powerPC 620 microprocessor in a multiprocessor computer

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 469-477

  Wong, Henry ^a   Lee, Tien Yu Tom ^a  

^a MOTOROLA INC   (United States)

Author keywords

Computational fluid dynamics; Electronic cooling; Heat sink

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING; FLOW OF FLUIDS; HEAT LOSSES; HEAT SINKS; MULTIPROCESSING SYSTEMS; THERMAL EFFECTS;

MEAN TIME BETWEEN FAILURE (MTBF);

MICROPROCESSOR CHIPS;

EID: 0030395829     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554927     Document Type: Review

References (10)

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