Electromigration in submicron wide copper lines

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 61-66

  Kononenko, O V ^a   Matveev, V N ^a   Koval, Yu I ^a   Dubonos, S V ^a   Volkov, V T ^a  

^a RUSSIAN ACADEMY OF SCIENCES   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ANNEALING; COPPER; DEPOSITION; DRY ETCHING; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; ELECTRON BEAM LITHOGRAPHY; ION BOMBARDMENT; OXIDATION; SILICON WAFERS;

SUBMICRON WIDE COPPER LINES;

SEMICONDUCTING FILMS;

EID: 0030394772     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-428-61     Document Type: Conference Paper

References (8)