|
Volumn 44, Issue 4, 1996, Pages 471-484
|
Low cost multilayer metallization system for silicon solar cells
|
Author keywords
Metal deposition process; Ni plating; Silicon solar cells
|
Indexed keywords
COPPER PLATING;
COST EFFECTIVENESS;
ELECTRIC CONDUCTIVITY OF SOLIDS;
ELECTRODEPOSITION;
METALLIC SUPERLATTICES;
METALLIZING;
NICKEL PLATING;
METAL DEPOSITION PROCESS;
MULTILAYER METALLIZATION SYSTEM;
SILICON SOLAR CELLS;
|
EID: 0030394524
PISSN: 09270248
EISSN: None
Source Type: Journal
DOI: 10.1016/S0927-0248(95)00170-0 Document Type: Article |
Times cited : (16)
|
References (11)
|