Diffusion bonding of Ti3Al base alloy

Journal of Materials Science and Technology

Volumn 12, Issue 6, 1996, Pages 467-469

  Guo, Yi ^a   Zhu, Jinman ^a   He, Zhijing ^a   Lian, Pifen ^a   Wu, Qing ^a   Zhang, Hong ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b Weihai University   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); MECHANICAL VARIABLES MEASUREMENT; MICROSTRUCTURE; TITANIUM ALLOYS;

DIFFUSION BONDING; TITANIUM ALUMINUM ALLOY;

BONDING;

EID: 0030393950     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. S.M.L.Satry and H.A.Lipsitt: Metall. Trans. A, 1977, 8A(10), 1543.
2. Zengyong ZHONG: Mater. Sci. Prog., 1990, 4(2), 132. (in Chinese)
3. Yi GUO, Peng LIU, Yiwen WU, Zijing HE and Dong LI: J. Mater. Sci. Technol., 1993, 9, 53.
4. P.Lefrancois, B.Criqui and M.Hovrcode: Weld. J., 1993, 7, 313.
5. C.E.Thornton, E.R.Wallach: Metal. Construction, 1985, 450R.