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Volumn , Issue , 1996, Pages 727-730

Impacts of Antenna Layout Enhanced Charging Damage on MOSFET Reliability and Performance

Author keywords

[No Author keywords available]

Indexed keywords

MOSFET DEVICES; PLASMA APPLICATIONS; PLASMA DEVICES; ANTENNAS; CRYSTAL DEFECTS; CURRENT DENSITY; DEGRADATION; GATES (TRANSISTOR); OXIDES; REACTIVE ION ETCHING; RELIABILITY; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DIODES; SEMICONDUCTOR PLASMAS;

EID: 0030393758     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.1996.554083     Document Type: Conference Paper
Times cited : (22)

References (9)
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  • 2
    • 0026867840 scopus 로고
    • Thin-oxidedamage from gate charging during plasma processing
    • S. Fang and J. P. McVittie, “Thin-oxidedamage from gate charging during plasma processing,” Electron Device Lett. EDL-13,p.288, 1992.
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    • Fang, S.1    McVittie, J.P.2
  • 3
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    • Plasma-damaged oxide reliability study correlating both hot-carrier injection and time-dependent dielectric breakdown
    • X. Li, J. -T. Hsu, P. Aum, D. Chan, J. Rembetski, and C. R. Viswnathan, “Plasma-damaged oxide reliability study correlating both hot-carrier injection and time-dependent dielectric breakdown,”Electron Device Lett. EDL-14, p.91, 1993.
    • (1993) Electron Device Lett , vol.EDL-14 , pp. 91
    • Li, X.1    Hsu, J.-T.2    Aum, P.3    Chan, D.4    Rembetski, J.5    Viswnathan, C.R.6
  • 4
    • 0027693956 scopus 로고
    • Modeling oxide thickness dependence of charging damage by plasma processing
    • H. Shin, K. Noguchi, and C. Hu, “Modeling oxide thickness dependence of charging damage by plasma processing,” Electron Device Lett. EDL-14, p.509, 1993.
    • (1993) Electron Device Lett , vol.EDL-14 , pp. 509
    • Shin, H.1    Noguchi, K.2    Hu, C.3
  • 5
    • 0028207697 scopus 로고
    • Quantitative evaluation of gate oxide damage during plasma processing using antenna-structure capacitors
    • K. Eriguchi, Y. Uraoka, H. Nakagawa, T. Tamaki, M. Kubota, and N. Nomura, “Quantitative evaluation of gate oxide damage during plasma processing using antenna-structure capacitors,” Jpn. J. Appl. Phys. no.1A, 33, p.83, 1994.
    • (1994) Jpn. J. Appl. Phys. No.1A , vol.33 , pp. 83
    • Eriguchi, K.1    Uraoka, Y.2    Nakagawa, H.3    Tamaki, T.4    Kubota, M.5    Nomura, N.6
  • 6
    • 0028529702 scopus 로고
    • Charge damage caused by electron shading effect
    • K. Hashimoto, “Charge damage caused by electron shading effect,”Jpn. J. Appl. Phys. no.1A, 33, p.6013, 1994.
    • (1994) Jpn. J. Appl. Phys. No.1A , vol.33 , pp. 6013
    • Hashimoto, K.1
  • 7
    • 0027813760 scopus 로고
    • Impact of plasma charging damage and diode protection on scaled thin oxide
    • H. Shin, Z. J. Ma, and C. Hu, “Impact of plasma charging damage and diode protection on scaled thin oxide,” IEDM Tech. Dig., p.467, 1993.
    • (1993) IEDM Tech. Dig. , pp. 467
    • Shin, H.1    Ma, Z.J.2    Hu, C.3
  • 8
    • 0029546458 scopus 로고
    • High density plasma etch induced damage to thin gate oxide
    • S. Krishnan, S. Aur, G. Wilhite, and R. Rajgopal, “High density plasma etch induced damage to thin gate oxide,” in IEDM Tech. Dig., p.315,1995.
    • (1995) IEDM Tech. Dig. , pp. 315
    • Krishnan, S.1    Aur, S.2    Wilhite, G.3    Rajgopal, R.4
  • 9
    • 0000652792 scopus 로고
    • Degradationof inversion layer electron mobility due to interface traps in metal-oxide-semiconductor transistors
    • T. Matsuoka, S. Taguchi, Q. D. M. Khosru, K. Taniguchi, and C. Hamaguchi, “Degradationof inversion layer electron mobility due to interface traps in metal-oxide-semiconductor transistors,”J. Appl. Phys. 78(5), p.3252, 1995.
    • (1995) J. Appl. Phys. , vol.78 , Issue.5 , pp. 3252
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.