Accurate, high speed modeling of integrated passive devices in multichip modules

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1996, Pages 184-186

  Poddar, Ravi ^a   Brooke, Martin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; EQUIVALENT CIRCUITS; GEOMETRY; MULTICHIP MODULES; SEMICONDUCTOR DEVICE STRUCTURES; SIMULATORS; SUBSTRATES;

HIGH SPEED CIRCUIT SIMULATORS; INTEGRATED PASSIVE DEVICES;

SEMICONDUCTOR DEVICE MODELS;

EID: 0030388685     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)