Cu deposition characteristics into submicron contact holes employing self-sputtering with a high ionization rate

Materials Research Society Symposium - Proceedings

Volumn 427, Issue , 1996, Pages 185-192

  Shingubara, S ^a   Sano, A ^a   Sakaue, H ^a   Takahagi, T ^a   Horiike, Y ^a   Radzimski, Z J ^a   Posadowski, W M ^a  

^a HIROSHIMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; COPPER; DIFFUSION IN SOLIDS; IONIZATION OF SOLIDS; MAGNETIC FIELD EFFECTS; MAGNETRON SPUTTERING; SPUTTER DEPOSITION; SUBSTRATES;

CONTACT HOLES; SELF SPUTTERING;

OHMIC CONTACTS;

EID: 0030387941     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-427-185     Document Type: Conference Paper

References (12)