Thermal stability and interaction between SiOF and Cu film

Materials Research Society Symposium - Proceedings

Volumn 427, Issue , 1996, Pages 433-439

  Mei, Yu Jane ^a   Chang, Ting Chang, ^a   Sheu, Jeng Dong ^a   Yeh, Wen Kuan ^a   Pan, Fu Ming ^a   Chang, Chun Yen ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; DIFFUSION IN SOLIDS; ELECTRIC BREAKDOWN OF SOLIDS; ELECTRIC CURRENT MEASUREMENT; PERMITTIVITY; SEMICONDUCTING SILICON COMPOUNDS; THERMODYNAMIC STABILITY; THIN FILMS; VOLTAGE MEASUREMENT;

COPPER DIFFUSION; POST DEPOSITION ANNEALING;

DIELECTRIC FILMS;

EID: 0030386963     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-427-433     Document Type: Conference Paper

References (5)