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Volumn 35, Issue 12 B, 1996, Pages
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Electrical characteristics of ultra-fine trench isolation fabricated by a new two-step filling process
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
CHEMICAL VAPOR DEPOSITION;
DRY ETCHING;
ELECTRIC BREAKDOWN;
ELECTRIC PROPERTIES;
ELECTRON BEAM LITHOGRAPHY;
MOSFET DEVICES;
OXIDES;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTOR DOPING;
SILICA;
ULSI CIRCUITS;
NARROW CHANNEL TRANSISTOR;
TETRAETHYL ORTHO SILICATE;
TRENCH ISOLATION;
INTEGRATED CIRCUIT MANUFACTURE;
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EID: 0030386305
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.35.l1625 Document Type: Article |
Times cited : (3)
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References (7)
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