SCOPUS 정보 검색 플랫폼

Volumn , Issue 122-124, 1996, Pages 17-34

Ceramic packaging for electronics

Author keywords

Ceramics; Electronics; Hybrids; Mature Single Component Packages; Multilayer Packages; Packaging; Power Packages; Thick Film Hybrids

Indexed keywords

ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; PERFORMANCE; PRINTED CIRCUIT BOARDS; RELIABILITY; SURFACE MOUNT TECHNOLOGY;

COMPLETE SYSTEM INTEGRATION; HYBRID CIRCUIT; INDIVIDUAL CHIP PACKAGES; MATURE SINGLE COMPONENT PACKAGES; MULTICHIP MODULE; MULTILAYER PACKAGES; POWER PACKAGES; THICK FILM HYBRIDS; TYPES OF PACKAGES; WIRING BOARDS;

CERAMIC MATERIALS;

EID: 0030385094 PISSN: 10139826 EISSN: 16629795 Source Type: Book Series
DOI: None Document Type: Article

Times cited : (3)

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15
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.