Development of JEDEC standard thermal measurement test boards

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 478-485

  Edwards, Darvin ^a,b  

^a IEEE

^b TEXAS INSTRUMENTS   (United States)

Author keywords

IC package thermal performance; Test PCB's; Thermal measurements; Thermal modeling; Thermal standards; Thermal testing

Indexed keywords

INTEGRATED CIRCUITS; MICROELECTRONICS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; STANDARDS; SURFACE MOUNT TECHNOLOGY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS; THERMAL VARIABLES MEASUREMENT;

BALL GRID ARRAYS (BGA); JOINT ELECTRON DEVICE ENGINEERING COUNCIL (JEDEC);

PRINTED CIRCUIT BOARDS;

EID: 0030384855     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554928     Document Type: Article

References (14)

1. Test Method for Still and Forced Air, Junction to Ambient Thermal Resistance of Integrated Circuit Packages, SEMI International Standards G38-87, 1992.
2. Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages, SEMI International Standards G42-88, 1990.
3. US Military Standards, Method 1012.1, Thermal Characteristics, MIL STD 883C, 1993.
4. Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Devices), JEDEC Standard 51.
5. Integrated Circuit Thermal Measurement Method - Electrical Test Method, JEDEC Standard 51-1
6. Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection (Still Air), JEDEC Standard 51-2.
7. Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages, JEDEC Standard 51-3.
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