Droplet-level modeling of thermal stresses in layered manufacturing methods

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1996, Pages

  Chin, Richard K ^a   Beuth, Jack L ^a   Amon, Cristina H ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DENSITY OF LIQUIDS; DROP FORMATION; ELASTIC MODULI; RESIDUAL STRESSES; SPECIFIC HEAT OF LIQUIDS; STRESS ANALYSIS; SUBSTRATES; THERMAL CONDUCTIVITY OF LIQUIDS; THERMAL STRESS;

DROPLET LEVEL MODELING; LAYERED MANUFACTURING PROCESS; MOLTEN METAL DEPOSITION MANUFACTURING; SHAPE DEPOSITION MANUFACTURING;

LIQUID METALS;

EID: 0030383125     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)