Encapsulation of silver by nitridation of Ag-Ti alloy/bilayer structures

Thin Solid Films

Volumn 290-291, Issue , 1996, Pages 411-416

  Laursen, T ^a   Adams, Daniel ^a   Alford, T L ^a   Tu, K N ^b   Deng, F ^c   Morton, R ^c   Lau, S S ^c  

^a ARIZONA STATE UNIVERSITY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Dealloying; Resistivity; Silver metallization; Titanium nitride

Indexed keywords

ANNEALING; COMPOSITION EFFECTS; ENCAPSULATION; FILM PREPARATION; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); REACTION KINETICS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SECONDARY ION MASS SPECTROMETRY; SILVER ALLOYS; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

DEALLOYING; SCANNING AUGER SPECTROSCOPY; SILVER METALLIZATION;

METALLIC FILMS;

EID: 0030382631     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(96)08964-X     Document Type: Article

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