A novel process for fabricating conformal and stable TiN-based barrier films

Journal of the Electrochemical Society

Volumn 143, Issue 12, 1996, Pages

  Lu, J P ^a,b   Hsu, W Y ^a   Hong, Q Z ^a   Dixit, G A ^a   Luttmer, J D ^a,b   Havemann, R H ^a   Magel, L K ^a,b  

^a TEXAS INSTRUMENTS   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; FILM PREPARATION; METALLIZING; ORGANOMETALLICS; PYROLYSIS; STABILITY; THIN FILMS; TITANIUM NITRIDE; X RAY PHOTOELECTRON SPECTROSCOPY;

ALUMINUM METALLIZATION; TETRAKIS(DIMETHYLAMINO)TITANIUM; TITANIUM NITRIDE BARRIER FILMS;

CERAMIC COATINGS;

EID: 0030381190     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837295     Document Type: Article

References (8)

1. A. Paranjpe and M. IslamRaja, J. Vac. Sci. Technol., B13, 2105 (1995).
2. R. I. Hegde, R. W. Fiordalice, E. O. Travis, and P. J. Tobin, ibid., B11, 1287 (1993).
3. S. C. Sun and M. H. Tsai, Thin Solid Films, 253, 440 (1994).
4. M. Eizenberg, K. Littau, S. Ghanayem, A. Mak, Y. Maeda, M. Chang, and A. K. Sinha, Appl. Phys. Lett., 65, 2416 (1994).
5. I. J. Raaijmakers and J. Yang, Appl. Surf. Sci., 73, 31 (1993).
6. G. A. Dixit, R. H. Havemann, L. Halliday, J. Strupp, B. Roberts, R. L. Jackson, and J. McInery, in Proceedings of VLSI multilevel Interconnect (VMIC)-XII p. 175 (1995).
7. I. J. Raaijmakers, Thin Solid Films, 247, 85 (1994).
8. H. S. Seo, J. T. Kim, B. H. Jung, H. L. Park, and J. C. Kim, in Proceedings of VLSI Multilevel Interconnect (VMIC)-XIII p. 593 (1996).