Mechanistic studies of hydrophilic wafer bonding and Si exfoliation for SOI fabrication

IEEE International SOI Conference

Volumn , Issue , 1996, Pages 150-151

  Weldon, M K ^a   Marsico, V ^a   Chabal, Y J ^a   Christman, S B ^a   Chaban, E E ^a   Jacobson, D C ^a   Sapjeta, J B ^a   Pinczuk, A ^a   Dennis, B S ^a   Mills, A P ^a   Goodwin, C A ^a   Hsieh, C M ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; BONDING; INFRARED SPECTROSCOPY; INTERFACES (MATERIALS); ION IMPLANTATION; RAMAN SPECTROSCOPY; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY;

HYDROGEN INDUCED SILICON EXFOLIATION; HYDROPHILIC WAFER BONDING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0030380852     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)