Processing aspects of glass-nicalon fibre and interconnected porous aluminium nitride ceramic and glass composites

Journal of Materials Science

Volumn 31, Issue 23, 1996, Pages 6229-6240

  Kumta, P N ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOROSILICATE GLASS; CERAMIC MATRIX COMPOSITES; ELECTRONICS PACKAGING; HOT PRESSING; INFILTRATION; MICROSTRUCTURE; OPTICAL PROPERTIES; PERMITTIVITY; SILICON CARBIDE; THERMAL CONDUCTIVITY; VOLUME FRACTION;

ALUMINUM NITRIDE; NICALON FIBRE; SILICON CARBIDE GRADE FIBRE BOROSILICATE GLASS COMPOSITES;

GLASS FIBERS;

EID: 0030379275     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00354443     Document Type: Article

References (40)

1. 'Microelectronic Packaging Handbook', Edited by R. R. Tummala and E. J. Rymaszewski, (Van Nostrand Reinhold, New York 1989).
2. G. GEIGER, Bull Amer Ceram Soc 69 (1990) 1131.
3. E. M. RABINOVICH, J. Electronic Packaging 111 (1989) 183.
4. R. R. TUMMALA and R. B. SHAW, High Tech Ceramics, edited by P. Vincenzini, (Elsevier Science Publishers B.V. Amsterdam, 1987) p. 75.
5. J. L. SPRAGUE, IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13 (1990) 390.
6. K. R. KINSMAN, J. Metals 6 (1988) 7.
7. J. U. KNICKERBOCKER and M. S. COLE, Advanced Packaging January/February (1995) 20.
8. R. L. BROWN, A. A. SHAPIRO and P. W. POLINSKI, The Intnl. J. Microelectronics and Elec. Packaging 16 (1993) 328.
9. N. KURAMOTO, H. TANIGUCHI and I. ASO, Cerm Bull 68 (1989) 883.
10. N. KURAMOTO and H. TANIGUCHI, J. Mater. Sci. Lett. 3 (1984) 471.
11. T. B. TROCZYNSKI and P. S. NICKOLSON, J. Amer. Ceram. Soc. 72 (1989) 1488.
12. N. S. VAN DAMME, S. M. RICHARD and S. R. WIZER, J. Amer. Ceram. Soc. ibid 72 (1989) 1409.
13. ATSUHIKO HIAI, TAKAISHI: KAZUO WAKIMURA, SENNAN: MASAO TANAKA, SAKAI: TAKAO TANAKA SHIMONOSEKI, Mitsui Toatsu Chemicals Inc, Tokyo, Japan, U.S. Patent No. 4869925 (1989).
14. U. KLABUNDE, W. CHESTER, E. J. NEWITT, C. FORD, F. N. TEBBE, H. DEL, U.S. Patent No. 4865830, (1989).
15. S. L. DOLE, R. H. ARENDT, W. D. PASCO, U.S. Pat. No. 4843042, (1989).
16. S. KURATANI, K. UNO, S. MIZUNO, H. SAKURAMOTO and S. NISHIYAMA, U.S. Pat. No. 4843038, (1989).
17. S. MIZUNO, S. KURATANI, K. UNO, H. SAKURAMOTO and S. NISHIYAMA, U.S. Pat No. 4833108, (1989).
18. A. IKEGAMI, K. OTSUKA and T. YASUDA, in: "High Thermal Conductive SiC Substrate and Its Applications", Proceedings of the 5th European Hybrid Microelectronics Conference, Stresa, Italy (International Society for Hybrid Microelectronics, Stresa, 1985) 465.
19. R. R. TUMMALA, J. Amer. Ceram. Soc. 74 (1991) 895.
20. A. J. BLODGETT, Jr., Scientific American 249 (1983) 2.
21. T. J. MROZ and E. A. GROAT, paper E-65-94, presented at the 94th. Annual meeting of the American Ceramic Society held in Indianapolis, IN, April 24-28, 1994.
22. J. F. MACDOWELL, G. H. BEALL, in Proceedings of the 1st International Science and Technology conference, "Materials and Processes for Microelectronic Systems", Ceramic Transactions, edited by K. M. Nair, R. Pohanka and R. C. Buchanan, Vol. 15 (1989) 259.
23. J. F. MACDOWELL, G. H. BEALL, Idem. Materials Research Society Symposium Proceedings, "Advanced Electronic Packaging Materials", edited by A. T. Barfknecht, J. P. Partridge, C. J. Chen and Che-Yu Li, Vol. 167 (1989).
24. R. S. HSU, P. N. KUMTA and T. P. FEIST, J. Mater. Sci., 30 (1995) 3123.
25. V. RAMAKRISHNAN and N. JAYARAMAN, J. Mater. Sci., Ibid 27 (1992) 2423.
26. M. BARSOUM and A. ELKIND, J. Mater. Sci., Ibid 30 (1995) 69.
27. W. D. KINGERY, H. K. BOWEN and D. R. UHLMANN, "Introduction to Ceramics" 2nd Edn (John Wiley & Sons, NY, 1976) p. 635.
28. A. J. MOULSON and J. M. HERBERT, "Electroceramics, Materials, Properties and Applications", (Chapman and Hall London 1990) p. 79.
29. L. E. CROSS and T. R. GURURAJA, Materials Research Society Symposium Proceedings, "Electronic Packaging Materials Science II", edited by K. A. Jackson, R. C. Pohanka, D. R. Uhlmann and D. R. Ulrich, Vol. 72 (1986).
30. D. P. BUTTON, B. A. YOST, R. H. FRENCH, W. Y. HSU, J. D. BOLT, M. A. SUBRAMANIAN, H. M. ZHANG, R. E. GIEDD, A. J. WHITAKER and D. G. ONN, Advances in Ceramics, Vol. 26, "Ceramics Substrates and Packages for Electronic Applications", edited by M. F. Yan, K. Niwa, H. M. O'Bryan, Jr., and W. S. Young, (American Ceramic Society 1989) pp. 87-105.
31. I. WEBMAN, J. JORTNER and M. H. COHEN, Phys. Rev. B 11 (1975) 2885.
32. W. Y. HSU, T. D. GIERKE, and C. J. MOLNAR, Macromolecules 16 (1983) 1945.
33. S. PROCHAZKA and C. F. BOBIK, Materials Science Research, Vol. 13, "Sintering Processes", edited by G. C. Kuczynski, Proceedings. 5th International Conference on Sintering and Related Phenomena, University of Notre Dame, Indiana, June 18-20 (1979) 321.
34. C. M. GUSTAFSON, R. E. DUTTON and R. J. KERANS, J. Amer. Ceram. Soc. 78 (1995) 1423.
35. N. P. BANSAL and R. H. DOREMUS, "Handbook of Glass Properties", (Academic Press, London 1986).
36. R. H. DOREMUS, "Glass Science", (John Wiley & Sons, New York, 1973) 284.
37. T. MAH, Private Conversation, (1993).
38. X. J. NING, P. PIROUZ and S. C. FARMER, J. Amer. Ceram. Soc. 76 (1993) 2033.
39. J. A. DICARLO, J. Mater. Sci. 21 (1986) 217.
40. J. I. ELDRIDGE and F. S. HONECY, J. Vac. Sci. Technol. A8 (1990) 2101.