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Volumn , Issue , 1996, Pages 230-242
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Using an ozone water last cleaning process to research the effects of process parameters on wafer contamination
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPOSITION EFFECTS;
CONTAMINATION;
HYDROFLUORIC ACID;
OXIDES;
OXYGEN;
OZONE;
PARTICLES (PARTICULATE MATTER);
PASSIVATION;
SURFACE CLEANING;
SURFACE PROPERTIES;
THERMAL EFFECTS;
WATER;
DEIONIZED WATER;
OZONE WATER;
SILICON WAFERS;
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EID: 0030368196
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (3)
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