In situ simultaneous measurement of temperature and thin film thickness with ultrasonic techniques

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 1996, Pages 1039-1042

  Pei, J ^a   Khuri Yakub, B T ^a   Degertekin, F L ^a   Honein, B V ^a   Stanke, F E ^a   Saraswat, Krishna C ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

IN SITU PROCESSING; PROCESS CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS; SILICON WAFERS; TEMPERATURE MEASUREMENT; THICKNESS MEASUREMENT; THIN FILMS; ULTRASONIC PROPAGATION; ULTRASONIC VELOCITY;

ALUMINUM SPUTTERING SYSTEM; ULTRASONIC LAMB WAVE;

ULTRASONIC MEASUREMENT;

EID: 0030360985     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)