Thermal analysis of two-phase microchannel cooling

American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) DSC

Volumn 59, Issue , 1996, Pages 137-140

  Chen, N C J ^a   Felde, D K ^a   Yoder, G L ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; HEAT FLUX; HEAT LOSSES; MICROELECTROMECHANICAL DEVICES; TEMPERATURE MEASUREMENT;

MICROCHANNEL WATER COOLING DESIGN;

WATER COOLING SYSTEMS;

EID: 0030352326     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

1. Bowers, M. B. and Mudawar, I., 1994(a) "High Flux Boiling in Low Flow Rate, Low Pressure Drop Mini-Channel and Micro-Channel Heat Sinks, International Journal of Heat and Mass Transfer, " Vol. 37, No. 2, pp. 321-332.
2. Bowers, M. B. and Mudawar, I., 1994(b) "Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1 - Design Criteria and Heat Diffusion Constraints," ASME Journal of Electronic Packaging, Vol. 116, pp. 290-297.
3. Bowers, M. B. and Mudawar, I., 1994(c) "Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2 - Flow Rate and Pressure Drop Constraints," ASME Journal of Electronic Packaging, Vol. 116, pp. 298-305..
4. Childs, K. W., 1993 "Heating 7.2 User's Manual, ORNL/TM-12262, Martin Marietta Energy Systems, Oak Ridge National Laboratory.
5. Collier, J. G., 1981 "Convective Boiling and Condensation," 2nd Edition, McGraw-Hill Inc., New York.
6. Incropera, F.P. and DeWitt, D. P., 1990 "Fundamentals of Heat and Mass Transfer," 3rd Edition, John Wiley & Sons, New York.
7. Mishima, K., 1984 "Boiling Burnout at Low Flow Rate and Low Pressure Conditions, Ph.D. Thesis," Kyoto University.
8. Phillips, R. J., 1990 "Microchannel Heat Sinks, Advances in Thermal Modeling of Electronic Components and Systems," Vol. 2, Chapter 3, pp. 109-184.
9. Tuckerman, D. B. and Pease, R. F. W., 1981 "High-Performance Heat Sinking for VLSI, IEEE Electron Device Letters," pp. 126-129, VOL. EDL-2, No. 5.