Experimental evaluation of micro heat exchangers fabricated in silicon

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 331, Issue , 1996, Pages 131-136

  Kuan, Nelson ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEAT RESISTANCE; SILICON WAFERS;

MICROHEAT EXCHANGERS;

HEAT EXCHANGERS;

EID: 0030349271     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. Kendall, D.L., "Vertical Etching of Silicon at Very High Aspect Ratios," Ann. Rev. Mater. Sci., vol. 9, pp373-403, 1979.
2. Kuan, N., Micro Heat Exchangers, Senior Design Project, University of Pennsylvania, 1995.
3. Lide, D.R., Kehiaian, H.V., CRC Handbook of Thermophysical and Thermochemical Data, CRC Press, 1994.
4. Peng, X.F., Wang, B.X., Peterson, G.P., Ma, H.B., "Experimental Investigation of Heat Transfer in Flat Plates with Rectangular Microchannels," Int. J. Heat Mass Transfer, vol. 38, No.1, pp. 127-137, 1995.
5. Petersen, K.E., "Silicon as a Mechanical Material," Proceeding of the IEEE, vol. 70, No. 5, May 1982,
6. Riddle, R.A., Contolini, R.J., Bernhardt, A.F., Design Calculations for the Microchannel Heat Sink, Lawrence Livermore National Laboratory, 1991.
7. Riddle, R.A., Bernhardt, A.F., The Microchannel Heatsink with Liquid Nitrogen Cooling, Lawrence Livermore National Laboratory, 1992.
8. Tuckerman, D. B. and Pease, R, Heat Transfer Microstructures for Integrated Circuits, Ph.D. Thesis, Stanford University, 1984.
9. Weisberg, A., Bau, H.H., and Zemel, J., "Analysis of Microchannels for Integrated Cooling," Int. J. Heat Mass Transfer, 35, pp. 2465-2474, 1992
10. Yin, X., and Bau, H.H., "Micro Heat Exchangers Consisting of Pin Arrays," Cooling and Thermal Design of Electronic Systems, ASME 95 IMECE Conference Proceedings HTD, 319/EEP 15 (Amon, C.H., editor), 59-66. Also accepted for publication in the J. Electronic Packaging.
11. Yin, X., and Bau, H.H., "Micro Heat Exchangers Consisting of Pin Arrays," Cooling and Thermal Design of Electronic Systems, ASME 95 IMECE Conference Proceedings HTD, 319/EEP 15 (Amon, C.H., editor), 59-66. Also accepted for publication in the J. Electronic Packaging.
12. Yin, X., and Bau, H.H., Uniform Channel Micro-Heat Exchangers, Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-Lin Tien. Also to appear in the Trans ASME, J. Electronic Packaging.
13. Yin, X., and Bau, H.H., Uniform Channel Micro-Heat Exchangers, Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-Lin Tien. Also to appear in the Trans ASME, J. Electronic Packaging.
14. Yin, X., Micro Heat Exchangers, Ph.D. Thesis, University of Pennsylvania, 1995.